MEMCON 2006 SHANGHAI
PROCEEDINGS

 

 

Day 1:Thursday April 6
 

 

 

Time SessionSpeaker Logo
9:00 Welcome & Introduction Lane Mason
Memory Market Analyst
Denali Software
9:10 Memory and Embedded Memory: Market, Technology & IP's Dr. Boon-Khim Liew
Associate Vice President
Semiconductor Manufacturing International Corporation
10:00 Advanced Multiple Chip Package Solutions- A PoP Discussion Sony Wei
Area Technical Manager, MPG China
Micron Technology, Inc.
10:30 Tackling Power Management through Design Chain Collaboration Michael McAweenay
VP- Industry Alliances
Cadence
11:00 Integrated Flash Memory Solutions Robert Pierce
Senior Director, Flash Products
Denali Software
11:30 Intel's Expanded Approach to Flash Greg Komoto
Strategic Planning Manager, Flash Memory Group
Intel Corporation
BREAK    
13:00 Change Brings Opportunities: Big Waves and Little Ripples in Today's Chip Business Lane Mason
Memory Market Analyst
Denali Software
13:45 Instruction to SecureMMC & New Business Opportunity KH Lee
Samsung Semiconductor, Inc.
14:15 Databahn™: Configurable Memory Controller IP for DDR Memory Systems Nalin Balan
Principal Application Engineer
Denali Software, Inc.
15:00 Designing Memory for Optimal Price-Performance with FPGAs David Gu
Field Applications Engineer
Micron Technology, Inc.
15:30
15:45 Modeling and Simulation Memory for System-On-Chip Design Nalin Balan
Principal Application Engineer
Denali Software, Inc.
16:15 Enabling Mass Market Usage of High-Density NAND in Multimedia Handsets Clarence Choi
China Country Manager
M-Systems
16:45 Can NAND Flash Save a Troubled Memory Market? Lane Mason
Memory Market Analyst
Denali Software
17:30 Close
 

 

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