Bill Gervasi
Vice President of Engineering
US Modular

Bill Gervasi has been involved in the definition of Double Data Rate SDRAM since its earliest inception. His background is in computer sciences and career highlights include 19 years at Intel where over the years he was systems hardware designer, software designer, and major accounts manager. Mr. Gervasi subsequently was with S3, Transmeta, Nelist, and SimpleTech driving unique memory interface configurations. Most recently he joined US Modular to manage the deployment of DRAM and flash products for both OEM and commercial markets. He has served on the JEDEC Board of Directors and chaired committees for DRAM parametrics and small form factor memory modules throughout the development of DDR1, DDR2, and DDR3. Mr. Gervasi holds numerous patents in memory and packaging design.